奥特斯科技（重庆）有限公司

AT&S is the European market leader and one of the globally leading manufacturers of high-end IC Substrates and high-value printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments as Mobile Devices, Automotive, Industrial, Medical and Advanced IC Packaging.

奥地利科技与系统技术股份公司（AT&S）简称奥特斯，是欧洲以及全球领先的高端半导体封装载板和高科技印制电路板制造商。集团致力于生产具有前瞻性技术的产品，并将工业领域的核心市场定位于：移动设备、汽车和航天、工业电子、医疗与健康以及先进半导体封装领域。

 

Established in 2011, AT&S Chongqing is located in Yuzui Town, Jiangbei District, Chongqing, and this isthe second sole proprietorship enterprise of AT&S Group established in China.

奥特斯科技（重庆）有限公司成立于2011年，是奥特斯集团在中国设立的第二家独资企业（工厂位于江北区鱼嘴镇）。

 

AT&S Chongqing produces the latest generation of high-end IC substrates for the use in computer microprocessor and HDI PCB for the use in mobile devices, wearable devices and high-end internet products. AT&S Chongqing has become the first high-end IC substrates manufacturer in China. 

奥特斯重庆生产全球领先的半导体封装载板和系统级封装印制电路板，产品应用于电脑微处理器、移动设备、可穿戴设备和高端物联网产品。奥特斯已成为中国唯一的新一代高端半导体封装载板制造商。

 

As one of the globally leading high-end connectivity solutions providers, AT&S is fully committed to investing in technology and innovation for semiconductors and microelectronics industry in China and contributing to the development of high-end and value-added manufacturing industry, and making contribution to the smart manufacturing.

作为一家全球领先的高科技互连解决方案供应商，奥特斯将持续在半导体和微电子产业投入创新技术，推动中国高端和高附加值产业的发展，为智能制造做出贡献。

  公司重要里程碑  

March, 2011

AT&SGroup signs its Chongqing project with Chongqing Liangjiang New Area

2011年3月

奥特斯集团与重庆两江新区政府签署项目协议

June, 2011

Constructionstarts on Phase I in Chongqing

2011年6月

重庆一期项目开工建设

January, 2013

AT&S enters the IC substrate market in cooperation with a leading manufacturer of semiconductors

2013年1月

奥特斯携手世界领先的半导体制造商进军半导体封装载板市场

May, 2015

AT&Sdecides to increase the investment program in Chongqing

2015年5月

奥特斯集团决定增资重庆工厂项目

April, 2016

Theramp-up of Plant

2016年4月

重庆一厂正式投产

August, 2016

The ramp-up of Plant II

2016年8月

重庆二厂正式投产

July,2019

AT&Sdecides to increase an investment volume one billion Euro to produce IC substrates to further expand the existing capacity

2019年7月

奥特斯集团决定增资10亿欧元用于重庆工厂三期项目，生产半导体封装载板，进一步扩大产能

 

奥特斯重庆鸟瞰图

Bird view of ATS Chongqing

公司大门

AT&S Chongqing Front Door

奥特斯先进的无尘生产车间

Advanced CR production floor

奥特斯拥有先进的环保设施

Advanced environmental protection facilities